Intel 12th Generation i7-1265UE Processor Rugged Embedded Computer
Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer
PRODUCTS FEATURES
- Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
- 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
- Quad Independent Display (2x DP/HDMI/CMI Display)
- 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
- 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
- CMI Technology for Optional I/O Module Expansions
- CFM Technology for Power Ignition Sensing Function & PoE
- ide Operating Temperature -40°C to 70°C
- Safety Standard: UL, cUL, CB, IEC, EN 62368-1
The DI-1200, with a 12th generation Intel® Core™ U-series (Alder Lake-P Platform) processor, provides outstanding performance and boasts a low power consumption of 15W. The compact DI-1200 offers rich I/O interfaces and expansion options, meeting the requirements for high-performance, rugged embedded computers used in confined spaces. It suits for industrial automation, warehousing and logistics, transportation, environmental monitoring, and IoT applications.


High Performance and Power Saving
The DI-1200 supports the 12th generation Core™ i7/i5/i3 U-series (Alder Lake-P) processor based on the Intel® 7 process. Its exceptional processing performance and ultra-low power consumption of just 15W, make it highly suitable for mobile devices limited by battery capacity.
Smaller than A5
The DI-1200 has a footprint smaller than a sheet of A5 paper, with dimensions of only 203 x 142 x 66.8 mm. It is ideal for mobile devices such as AGVs and AMRs, tight spaces in vehicles, or small cabinets in factories.




High-speed I/O
The DI-1200 offers a range of high-speed I/O, including LAN (10GbE, 2.5GbE, 1GbE), USB 3.2 (10Gbps, 5Gbps), USB 2.0, and more, making data and image transmission faster and allowing easy connection to various high-speed devices.
Comprehensive Wireless Options
The DI-1200 has one M.2 Key E slot and one M.2 Key B slot, supporting a full range of wireless transmission options, including GSM, GNSS, Wi-Fi, and Bluetooth. It also supports the Intel CNVi module, meeting diverse transmission needs.




Quick Hard Drive Removal
Mobile devices must allow quick access to data. The DI-1200 features a hot-swappable 2.5-inch SATA HDD/SSD slot in the front panel of the chassis, making it easy to remove the hard drive and access the data on it.
Secure and Rugged
The DI-1200 showcases its ruggedness and industrial-grade protections through multiple industry certifications. It complies with industrial EMC standards (IEC 61000-6-2 and IEC 61000-6-4), ensuring reliable operation in external electromagnetic interference from surrounding devices. The DI-1200 also meets the U.S. military standard, MIL-STD-810H, ensuring stable operation under extreme shock and vibration conditions.


- Processor
- Intel® Core™ i7-1265UE 10 Cores Up to 4.70 GHz, TDP 15W
- Memory
- 1x DDR5 SO-DIMM Socket,
- Supports Un-buffered and non-ECC Type, Up to 32GB
- Graphics Engine
- ntegrated Intel® UHD Graphics: Core™ i3-1215UE
- Maximum Display Output
- Supports Quad Independent Display
- HDMI 1x HDMI Connector (3840 x 2160@60Hz)
- DP 2x DisplayPort Connector (3840 x 2160@60Hz)
- CMI Display 1x CMI Interface for Optional CMI-DP/CMI-HDMI/CMI-VGA Module Expansion
- Line-out 1 x Line-out, Phone Jack 3.5mm
- Mic-in 1 x Mic-in, Phone Jack 3.5mm
- I/O
- LAN
- 2x 2.5 GbE LAN, RJ45
- GbE1: Intel® I225
- GbE2: Intel® I225
- COM 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
- USB
- 1 x USB 3.2 Gen2x1 (10Gbps), Type A
- 2 x USB 3.2 Gen1x1 (5Gbps), Type A
- 3 x USB 2.0 (480Mbps), Type A
- Storage SSD/HDD
- 1x 2.5" SATA HDD/SSD Bay (SATA 3.0)
- M.2 SSD
- 1 x M.2 SSD shared by M.2 Key B Type 3052 Socket
- RAID Support RAID 0/1
- LAN
- Expansion
- M.2 Key E Socket
- 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x1 / USB2.0), Support Wireless/Intel CNVi Module Expansion
- * The maximum height of the M.2 Key E add-on card is limited to 6.7mm.
- M.2 Key B Socket
- 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x1 / USB3.2 Gen2 x1 / USB2.0 / SATA ), Support 5G/Storage/Add-on Card Expansion
- * The maximum height of the M.2 Key B add-on card varies depending on the installed CMI module. Please refer to the manual for detailed information.
- SIM Socket 2 x Front Accessible SIM Socket
- CMI (Combined Multiple I/O) Interface
- 1x CMI Interface for optional CMI-LAN Module Expansion
- 1x CMI Interface for optional CMI-Display / CMI-COM / CMI-DIO Module Expansion
- CFM (Control Function Module) Interface
- 1x CFM IGN Interface for optional CFM-IGN Module Expansion
- M.2 Key E Socket
- Other Function
- External FAN Connector 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS)
- Clear CMOS Switch 1x Clear CMOS Switch
- Reset Button 1x Reset Button
- Instant Reboot Support 0.2sec Instant Reboot Technology
- Watchdog Timer Software Programmable Supports 256 Levels System Reset
- Power
- Power Button 1 x ATX Power On/Off Button
- Power Mode Switch 1 x AT/ATX Mode Switch
- Power Input 9 - 48VDC, 3-pin Terminal Block
- Remote Power On/Off 1 x Remote Power On/Off, 2-pin Terminal Block
- Remote Power LED 1 x Remote Power LED, 2-pin Terminal Block
- Physical
- Dimension ( W x D x H ) 203 x 142 x 66.8 mm
- Weight Information 1.8 KG
- Mechanical Construction Extruded Aluminum with Heavy Duty Metal
- Mounting Wall / Side / DIN-RAIL / VESA Mount
- Physical Design
- Fanless Design
- ableless Design
- Jumper-less Design
- Unibody Design
- Reliability & Protection
- Reverse Power Input Yes
- Over Voltage Protection
- Protection Range: 51~58V
- Protection Type: shut down operating voltage, re-power on at the preset level to recover
- Over Current Protection 15A
- CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
- MTBF 486,235 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3
- Operating System
- Windows®11, Windows®10
- Environment
- Operating Temperature -40°C to 70°C
- Storage Temperature -40°C to 70°C
- Relative Humidity 95% RH @ 70°C (Non-condensing)
- Shock MIL-STD-810H
- Vibration MIL-STD-810H
- EMC
- CE, UKCA, FCC, ICES-003 Class A
- EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only)
- EN 50155 (EN 50121-3-2 Only)
- E-mark (Pending)
- EMI
- CISPR 32 Conducted & Radiated: Class A
- EN/BS EN 50121-3-2 Conducted & Radiated: Class A
- EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
- EN/BS EN 61000-3-3 Voltage fluctuations & flicker
- FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
- EMS
- EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
- EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
- EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 2 kV; Signal: 2 kV
- EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
- EN/IEC 61000-4-6 CS: 10V
- (**Compliant with the standard when utilizing shielded cable.)
- EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
- EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
- Safety UL, cUL, CB, IEC, EN 62368-1
Memory: 8GB DDR5 SODIMM Unbuffered Non-ECC
Storage: 250GB Solid State Drive, SATA3
Operating System: None
Power Supply: 60W AC/DC Power Supply, 12V/5A