Intel® Arrow Lake-S Core™ Ultra 200S Series Industrial Rugged Embedded Computer
Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and Compact Rugged Embedded Computer
PRODUCTS FEATURES
- Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
- 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
- Wide Operating Temperature -40°C to 60°C
- Optional CMI Modules for I/O Expansion
- Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE


The DX-1300 is a compact industrial computer engineered for high-performance edge computing. Powered by an Intel Arrow Lake-S Core™ Ultra 200S series processor, it supports demanding edge applications, including advanced image processing, AI inference, and data integration across multiple tasks. The DX-1300 series packs exceptional computing performance and a rich feature set into a compact chassis while maintaining industrial-grade ruggedness. It is particularly well-suited for high-performance applications with limited installation space and has earned high acclaim in the manufacturing, in-vehicle, and railway markets.


Next-generation Edge AI computing performance
The Intel® Core™ Ultra 200S series processors deliver up to 36 TOPS of AI computing performance through an integrated CPU, GPU, and NPU. This design, specifically for AI acceleration, delivers more than a 3.5x improvement over the previous generation platform.
Compact chassis
Measuring only 242 x 173 x 75mm, the compact chassis has a footprint comparable to an 11-inch iPad. This enables flexible deployment in space-constrained environments such as control cabinets, equipment interiors, or in-vehicle systems.




Rich and versatile expandability
Multiple built-in M.2 B/E key slots offer flexible support for wireless communication modules (5G, GNSS, Wi-Fi, Bluetooth), high-speed storage (NVMe SSD), and high-capacity storage (SATA SSD). It also supports I/O expansion modules, allowing for versatile configurations tailored to specific application needs.
Stable, high-speed data transmission
Fast and reliable data transmission is crucial for applications such as image capture and surveillance. The DX-1300 supports multiple high-speed I/O ports, including 10/2.5/1 GbE LAN and USB 3.2. It can be expanded to support up to 12x LAN ports or 8x PoE, effectively simplifying cabling.




Rugged and multi-vertical certifications
The rugged design of the DX-1300 complies with military standards (MIL-STD-810H), railway certifications (EN 50121-3-2 & EN 45545-2), ensuring reliable operation in various harsh environments.
- Processor
- Arrow Lake-S Ultra 200S Series CPU:
- Intel® Core™ Ultra 9 285T 24 Cores Up to 5.4 GHz, TDP 35W
- Intel® Core™ Ultra 7 265T 20 Cores Up to 5.3 GHz, TDP 35W
- Intel® Core™ Ultra 5 245T 14 Cores Up to 5.1 GHz, TDP 35W
- Intel® Core™ Ultra 5 225T 10 Cores Up to 4.9 GHz, TDP 35W
- Chipset Intel W880 Chipset
- Memory
- 2x DDR5 SODIMM/CSODIMM Socket, Support Un-buffered and ECC Type
- Ultra 9 / 7: Supports Up to 6400MHz, 96GB
- Ultra 5: Supports Up to 5600MHz, 96GB
- 2x DDR5 SODIMM/CSODIMM Socket, Support Un-buffered and ECC Type
- Graphics Engine
- Integrated Intel® Xe LPG Graphics
- Maximum Display Output Supports Three Independent Display
- VGA 1x VGA Connector : 1920 x 1200@60Hz
- DP
- HDMI
- 1x HDMI Connector : 4096x2160@30Hz
- * Verified maximum resolution: 3840x2160 @30Hz
- LAN
- 2x 2.5 GbE LAN, RJ45
- GbE1~2: Intel® I226
- 2x 2.5 GbE LAN, RJ45
- COM
- 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
- USB
- 4x 10Gbps USB 3.2 Gen2x1, Type A
- 4x 5Gbps USB 3.2 Gen1x1, Type A
- Storage / Expansion
- 2.5" SSD / HDD
- 2x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 )
- M.2 Key B Socket
- 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen1x1 / SATA), Support 5G / GNSS / Storage / Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket (PCIe Gen 4x2 / SATA / USB 2.0), Support Storage / Add-on Card Expansion
- M.2 Key E Socket
- 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless / Bluetooth / Storage / Intel CNVi Module Expansion
- 2.5" SSD / HDD
- SIM
- 1x SIM Socket
- CMI (Combined Multiple I/O) Socket
- 2x High Speed CMI Interface for optional CMI Module Expansion
- 1x Low Speed CMI Interface for optional CMI Module Expansion
- CFM (Control Function Module) Socket
- 1x CFM-IGN Interface for optional CFM-IGN Module Expansion
- 1x CFM-TPM Interface for optional CFM-TPM Module Expansion
- Other Function
- RAID
- Support RAID 0/1/5/10
- Power Ignition Sensing
- Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module)
- TPM
- Support Discrete TPM2.0 (with Optional CFM Module)
- Clear CMOS Switch
- 1x Clear CMOS Switch
- Reset Button
- 1x Reset Button
- Instant Reboot
- Support 0.2sec Instant Reboot Technology
- Watchdog Timer
- Software Programmable Supports 256 Levels System Reset
- Antenna Holes
- 3
- Power Mode Switch
- 1x AT/ATX Mode Switch
- RAID
- Power Input
- 9 - 48VDC, 3-pin Terminal Block
- Remote Power On/Off
- 1x Remote Power On/Off, 2-pin Terminal Block
- Remote Power LED
- 1x Remote Power LED, 2-pin Terminal Block
- Max Power Consumption
- 35W CPU: 162W
- 65W CPU: 272.88W
- - Test conducted with CPU, 1x RAM, and 1x storage
- - 100% load during burn-in test
- Inrush Current (Peak)
- Physical
- Dimension ( W x D x H ) 242.2 x 173 x 75mm
- Weight Information 3.59 kg
- Mechanical Construction Extruded Aluminum with Heavy Duty Metal
- Mounting
- Wall Mount / DIN-Rail / VESA / Side Mount
- Physical Design
- Fanless Design
- Cableless Design
- Jumper-less Design
- Unibody Design
- Reliability & Protection
- Reverse Power Input Protection Yes
- Over Voltage Protection
- Protection Range: 51~58V
- Protection Type: shut down operating voltage, re-power on at the preset level to recover
- Over Current Protection
- 15A
- CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
- MTBF 332,808 Hours
- - Database: Telcordia SR-332 Issue3, Method 1, Case 3
- Operating System
- Windows
- Windows®11, Windows®10
- Linux
- Ubuntu 24.04
- Windows
- Environment
- Operating Temperature
- 35W TDP Processor: -40°C to 60°C (-40℉ to 140℉)
- 65W TDP Processor: -40°C to 50°C (-40℉ to 122℉) With External Fan Kit
- - With extended temperature peripherals; Ambient with air flow
- - According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
- Storage Temperature -40°C to 85°C (-40℉ to 185℉)
- Relative Humidity 95%@60°C (non-Condensing)
- Shock MIL-STD-810H
- Vibration MIL-STD-810H
- Operating Temperature
- EMC
- CE, UKCA, FCC, ICES-003 Class A
- EMI
- CISPR 32 Conducted & Radiated: Class A
- EN/BS EN 50121-3-2 Conducted & Radiated: Class A
- EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
- EN/BS EN61000-3-3 Voltage fluctuations & flicker
- FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
- EMS
- EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
- EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
- EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 1 kV; Signal: 2 kV
- EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
- EN/IEC 61000-4-6 CS: 10V
- EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
- EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
- Railway
- EMC
- EN 50155: 2021 Clause 4.4.6, 13.4.9
- - EN 50121-1 : 2017
- - EN 50121-3-2: 2016 + A1: 2019
- EN 50155: 2021 Clause 4.4.6, 13.4.9
- EMC
- Fire Protection EN 45545-2
- Safety
- UL, cUL, CB, IEC, EN 62368-1