Cincoze 10th Generation Intel® Rugged Embedded Industrial Computer with PCIe Expansion

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SKU
DS-1300

Cincoze 10th Generation Intel® Xeon/Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer and PCIe Expandable Rugged Embedded Computer, Supports up to 2x PCI/PCIe Expansion Slot

 
PRODUCTS FEATURES
  • 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
  • 2x GbE LAN and optional 2x 10GbE LAN
  • 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
  • Up to 2x PCI/PCIe expansion slots
  • 3x full-size Mini PCIe sockets, 2x SIM card slots
  • Optional CMI modules for I/O expansion
  • Optional CFM modules for ignition sensing & PoE
  • Wide operating temperature -40°C to 70°C
  • MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)
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The DS-1300 Series is a powerful embedded computer and brings unrivalled performance. It has versatile functionalities and rich industrial I/O. And most importantly, it has dual PCI/PCIe expansion capability. Equipped with Cincoze’s CMI, CFM, MEC modular expansion, customization for additional I/O or other functionality to fulfill different applications couldn’t be easier. The DS-1300 Series meets the requirements of industrial environments and is certified with industry standards. It delivers ultimate and reliable performance for factory automation, industrial automation and rolling stock applications.


10-Core, Up To 80 W CPU

The DS-1300 series, powered by a workstation-grade 10th-gen Intel® Xeon® or Core™ i9/i7/i5/i3 CPU with up to 10-core architecture, provides superior processing performance. The DS-1300 Series supports Xeon® CPU up to 80 W TDP. It incorporates DDR4 2933/2666 MHz memory up to 64 GB, delivering unparalleled performance in a rugged, fanless system.


More Powerful & Faster
Multiplies Productivity

The DS-1300 series's 10th-gen CPU brings to 31% better integer multi-tasking for compute-intensive application performance than 9th-gen CPUs*. DDR4 2933 MHz memory further increases speed by 10%**. The processing platform delivers the performance required to consolidate multiple workloads for intelligent devices and applications.

* 31% increase for 10th-gen i9-10900E 65W vs 9th-gen i7-9700 65W CPU
** 10% increase for 2933 MHz of DS-1300 vs 2666 MHz of DS-1200.


Industrial I/O and
Modular Expansion

The DS-1300 series offers a vast array of industrial-focused I/O including up to 2x GbE LAN, 6x USB 3.2, and 2x USB 2.0, 2x RS232/422/485, 2x 2.5" SATA, 3x mSATA, 1x M.2 key M for NVMe SSD, 2x SIM card slots, 3x full-size Mini-PCIe and triple independent displays (DisplayPort, HDMI, VGA). It also features modular expansion through Cincoze’s CMI/CFM modules, adding additional I/O or other functionality such as high-speed 10GbE LAN, PoE, and ignition sensing.


PCI/PCIe
Add-on Cards

DS-1300 Series can accommodate up to dual PCI/PCIe add-on cards up to 111 mm x 235 mm (combined max 110 W). Flexible PCI/PCIe expansion allows the addition of I/O, GPU, image capture, data acquisition, and motion control cards for specific applications.


Adjustable
PCIe Card Retainer

The PCI/PCIe expansion slots include two adjustable card retainers that firmly secure the PCI/PCIe add-on cards. The retainer is a cool feature that provides the extra protection needed to prevent add-on cards from shaking loose in high-vibration environments like rolling stock.

Patent No. I773359


Rugged Reliability
Against Rigorous Environments

The DS-1300 series's fanless and cableless industrial-grade design can withstand rigorous environments. Its unique thermal design supports an extended operating temperature range from -40°C to 70°C. It has also passed stringent industry standards, including MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only) for rolling stock environments.

  • Processor Intel® Core® Series Processor ( 65W / 35W ):
    • Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W
    • Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W
    • Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W
    • Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W
    • Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W
    • Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W
    • Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W
    • Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W
  • Memory    
    • 2x DDR4 2933/2666/2400 SO-DIMM Socket
  • Graphics    
    • Graphics Engine    Integrated Intel® UHD-630 Graphics
    • Maximum Display Output    Supports Triple Independent Display
    • HDMI    1 x HDMI Connector (4096 x 2160@30Hz)
    • DP    2x DisplayPort Connector (4096 x 2304 @ 60Hz, According to CPU Specifications) * Verified maximum resolution: 3840x2160
    • VGA    1 x VGA Connector (1920 x 1200 @60Hz)
  • I/O    
    • LAN
      • 2 x GbE LAN, RJ45
      • GbE1: Intel® I219
      • GbE2: Intel® I210
    • COM    
      • 2 x RS-232/422/485 with Auto Flow Control ( Supports 5V / 12V ), DB9
    • USB    
      • 2 x 10Gbps USB 3.2 Gen2, Type A
      • 4 x 5Gbps USB 3.2 Gen1, Type A
      • 2 x 480Mbps USB 2.0, Type A
    • PS/2    1 x PS/2, 6 Pin Mini-DIN Female Connector
  • Storage    
    • SSD/HDD    
      • 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 )
      • 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 )
      • RAID    Support RAID 0/1/5/10
    • mSATA    3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )
    • M.2 SSD    1x M.2 Key M Type 2280 Socket, Support PCIe x4 NVMe SSD or SATA SSD ( SATA 3.0 )
  • Expansion    
    • PCI Express        
      • 1 x PCI/PCIe Expansion Slot with Optional Riser Card * Supports maximum dimensions of add-on card (H x L): 111 x 235 mm    
      • 2 x PCI/PCIe Expansion Slot with Optional Riser Card * Supports maximum dimensions of add-on card (H x L): 111 x 235 mm
    • Mini PCI Express    3 x Full-size Mini-PCIe Socket
    • SIM Socket    2 x SIM Socket
    • CMI (Combined Multiple I/O) Interface    
      • 2 x High Speed CMI Interface for optional CMI Module Expansion
      • 2 x Low Speed CMI Interface for optional CMI Module Expansion
    • CFM (Control Function Module) Interface    1 x CFM IGN Interface for optional CFM-IGN Module Expansion
  • Power Ignition Sensing    Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module)
  • Clear CMOS Switch    1 x Clear CMOS Switch
  • Reset Button    1 x Reset Button
  • Watchdog Timer    Software Programmable Supports 256 Levels System Reset
  • Power Input    9 - 48VDC, 3-pin Terminal Block
  • Physical    
    • Dimension ( W x D x H )    
      • 227 x 261 x 88 mm   (Base Unit)
      • 227 x 261 x 108 mm (With one PCI/PCIe expansion slot)   
      • 227 x 261 x 128 mm (With two PCI/PCIe expansion slots)
  • Weight Information    
    • 4.5 KG  (Base Unit) 
    • 5.04 KG (With one PCI/PCIe expansion slot)  
    • 5.4 KG  (With two PCI/PCIe expansion slots)
  • Mechanical Construction    Extruded Aluminum with Heavy Duty Metal
  • Mounting    Wall Mount
  • Physical Design    
    • Fanless Design
    • Cableless Design
    • Jumper-less Design
    • Unibody Design
  • Reliability & Protection    
    • Reverse Power Input Protection    Yes
    • Over Voltage Protection   
      • Protection Range: 51~58V
      • Protection Type: shut down operating voltage, re-power on at the preset level to recover
    • Over Current Protection    15A
    • CMOS Battery Backup    SuperCap Integrated for CMOS Battery Maintenance-free Operation
    • MTBF    • 371,393 Hours
      • - Database: Telcordia SR-332 Issue 3, Method 1, Case 3
  • Operating System    
    • Windows    Windows® 10
    • Linux    Supports by project
  • Environment    
    • Operating Temperature    
      • 35W TDP Processor: -40°C to 70°C
      • 58W – 65W TDP Processor: -40~50°C (With External Fan Kit)
      • 80W TDP Processor: -40~40°C (With External Fan Kit)
      • * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
      • * With extended temperature peripherals; Ambient with air flow
      • * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
    • Storage Temperature    -40°C to 85°C
    • Relative Humidity    95%RH @ 70°C (non-Condensing)
    • Shock    MIL-STD-810G
    • Vibration    MIL-STD-810G
  • EMC   
    • CE, UKCA, FCC, ICES-003 Class A
    • EN 50155 (EN 50121-3-2 Only)
  • EMI   
    • CISPR 32 Conducted & Radiated: Class A
    • EN/BS EN 50121-3-2 Conducted & Radiated: Class A
    • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
    • EN/BS EN61000-3-3 Voltage fluctuations & flicker
    • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
  • EMS   
    • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
    • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
    • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
    • EN/IEC 61000-4-5 Surges: AC Power: 2 kV
    • EN/IEC 61000-4-6 CS: 10V
    • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
    • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
  • Safety   
    • IEC/EN 62368-1