Cincoze Compact Rugged Embedded Computer with Intel® Alder Lake-N Processor

$0.00
SKU
DC-1300

Intel® Alder Lake-N Processor Entry Performance and Compact Rugged Embedded Computer

 

PRODUCTS FEATURES
  • Onboard Intel® Alder Lake-N Core™ i3-N305, Processor N97 and Atom® x7425E Processor
  • 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 16GB Memory
  • 1x M.2 Key B Type 3052/3042 Socket for 5G/GNSS Module Expansion
  • 1x M.2 key B Type 2242 Socket for I/O Module Expansion
  • CMI Technology for Optional I/O Module Expansions
  • CFM Technology for Power Ignition Sensing Function
  • Safety Standard: UL, cUL, CB, IEC, EN 62368-1

The DI-1200, with a 12th generation Intel® Core™ U-series (Alder Lake-P Platform) processor, provides outstanding performance and boasts a low power consumption of 15W. The compact DI-1200 offers rich I/O interfaces and expansion options, meeting the requirements for high-performance, rugged embedded computers used in confined spaces. It suits for industrial automation, warehousing and logistics, transportation, environmental monitoring, and IoT applications.


High Performance and Power Saving


The DI-1200 supports the 12th generation Core™ i7/i5/i3 U-series (Alder Lake-P) processor based on the Intel® 7 process. Its exceptional processing performance and ultra-low power consumption of just 15W, make it highly suitable for mobile devices limited by battery capacity.


Smaller than A5


The DI-1200 has a footprint smaller than a sheet of A5 paper, with dimensions of only 203 x 142 x 66.8 mm. It is ideal for mobile devices such as AGVs and AMRs, tight spaces in vehicles, or small cabinets in factories.


High-speed I/O


The DI-1200 offers a range of high-speed I/O, including LAN (10GbE, 2.5GbE, 1GbE), USB 3.2 (10Gbps, 5Gbps), USB 2.0, and more, making data and image transmission faster and allowing easy connection to various high-speed devices.


Comprehensive Wireless Options


The DI-1200 has one M.2 Key E slot and one M.2 Key B slot, supporting a full range of wireless transmission options, including GSM, GNSS, Wi-Fi, and Bluetooth. It also supports the Intel CNVi module, meeting diverse transmission needs.


Quick Hard Drive Removal


Mobile devices must allow quick access to data. The DI-1200 features a hot-swappable 2.5-inch SATA HDD/SSD slot in the front panel of the chassis, making it easy to remove the hard drive and access the data on it.


Secure and Rugged


The DI-1200 showcases its ruggedness and industrial-grade protections through multiple industry certifications. It complies with industrial EMC standards (IEC 61000-6-2 and IEC 61000-6-4), ensuring reliable operation in external electromagnetic interference from surrounding devices. The DI-1200 also meets the U.S. military standard, MIL-STD-810H, ensuring stable operation under extreme shock and vibration conditions.

  • Processor
    • Intel® Core™ i3-N305 8 Cores Up to 3.80 GHz, TDP 15W
    • Intel® Processor N97 4 Cores Up to 3.60 GHz, TDP 12W
    • Intel Atom® x7425E 4 Cores Up to 3.40 GHz, TDP 12W
  • Memory    
    • 1x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and non-ECC Type, Up to 16GB
  • Graphics Engine    
    • Integrated Intel® UHD Graphics
    • Maximum Display Output    
      • Supports Two Independent Display  (Onboard 1x DisplayPort + Optional CMI 1x Display)
    • DP
      • 1x DisplayPort Connector (4096 x 2304 @60Hz)
      • * Verified maximum resolution: 3840 x 2160 @ 60Hz
  • I/O
    • LAN
      • 2x 2.5GbE LAN, RJ45
      • GbE1: Intel® I226
      • GbE2: Intel® I226
    • USB
      • 2 x USB 3.2 Gen2x1 (10Gbps), Type A
      • 1 x USB 3.2 Gen1x1 (5Gbps), Type A
      • 1 x USB 2.0 (480Mbps), Type A
    • COM
      • x RS-232/422/485 with Auto Flow Control (Support 5V/12V), DB9
    • Storage / Expansion
      • 2.5” Storage
        • 1x 2.5" SATA HDD/SSD or 1x Half-Slim SSD (SATA 3.0)
      • M.2 Key B Socket
        • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x1 / USB3.2 Gen2 x1 / SATA), Support 5G/Storage/GNSS/Add-on Card Expansion
        • 1x M.2 Key B Type 2242 (PCIe Gen 3x1 / USB2.0), Support GNSS/Add-on Card Expansion
      • SIM Socket
        • 1x Front Accessible Dual Nano SIM Socket
  • CMI (Combined Multiple I/O) Interface
    • 1x CMI Interface for optional Display or I/O Module Expansion
    • 1x CMI Interface for optional I/O Module Expansion
  • CFM (Control Function Module) Interface
    • 1x CFM Interface for optional IGN Module Expansion
  • Other Function    
    • Clear CMOS Switch 1x Clear CMOS Switch
    • Reset Button 1x Reset Button
  • Watchdog Timer
    • Software Programmable Supports 256 Levels System Reset
  • Status LED Indicator
    • Power LED, Storage LED, IGN LED
  • Antenna Holes
    • 2x Antenna Holes
  • Power Button
    • 1x ATX Power On/Off Button
  • Power Mode Switch
    • 1x AT/ATX Mode Switch
  • Power Input
    • 9 - 48VDC, 3-pin Terminal Block
  • Remote Power On/Off    
    • 1x Remote Power On/Off, 2-pin Terminal Block
  • Max. Power Consumption    
    • i3-N305 CPU: 49.4W
    • N97 CPU: 35.9W
      • Test conducted with CPU, 1x RAM, and 1x storage 100% load during burn-in testing
  • Inrush Current (Peak)
  • Remote Power LED
    • 1x Remote Power LED, 2-pin Terminal Block
  • Physical
    • Dimension ( W x D x H )    
      • 185 x 131 x 56.5 mm
    • Weight Information
      • 1.5 Kg
  • Mechanical Construction
    • Extruded Aluminum with Heavy Duty Metal
  • Mounting
    • Wall / Side / DIN-RAIL / VESA Mount
  • Physical Design
    • Fanless Design
    • Cableless Design
    • Jumper-less Design
    • Unibody Design
    • Reliability & Protection
  • Reverse Power Input
    • Yes
  • Over Voltage Protection
    • Protection Range: 51~58V
    • Protection Type: shut down operating voltage, re-power on at the present level to recover
  • Over Current Protection
    • 15A
  • MTBF 520,224 Hours
    • Database: Telcordia SR-332 Issue 3, Method 1, Case 3
  • Operating System
    • Microsoft® Windows®    
      • Windows®11, Windows®10
    • Linux    
      • Ubuntu Desktop 22.04 LTS
  • Environment
    • Operating Temperature
      • 12W TDP Processor: -40°C to 70°C (-40°F to 158°F)
      • 15W TDP Processor: -40°C to 60°C (-40°F to 140°F)
      • 15W TDP Processor: -40°C to 65°C (-40°F to 149°F) with External Fan Kit
        •   * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
        •   * With extended temperature peripherals and 1.2 m/s ambient airflow
        •   * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
    • Storage Temperature
      • -40°C to 85°C (-40°F to 185°F)
    • Relative Humidity
      • 12W TDP Processor: 95% RH @ 70˚C (Non-condensing)
      • 15W TDP Processor: 95% RH @ 60˚C (Non-condensing)
    • Shock
      • MIL-STD-810H
    • Vibration
      • MIL-STD-810H
  • EMC
    • CE, UKCA, FCC, ICES-003 Class A
  • EMI
    • CISPR 32 Conducted & Radiated: Class A
    • EN/BS EN 55032 Conducted & Radiated: Class A
    • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
    • EN/BS EN61000-3-3 Voltage fluctuations & flicker
    • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
  • EMS
    • EN/IEC 61000-4-2 ESD: Contact: 4 kV; Air: 8 kV
    • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 10 V/m
    • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 1 kV; Signal: 1 kV
    • EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
    • EN/IEC 61000-4-6 CS: 10V
      • (**Compliant with the standard when utilizing shielded ethernet cable.)
    • EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
    • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
  • Industrial Environment
    • EMC
      • EN/BS/IEC 61000-6-4: 2019 Class A
      • EN/BS/IEC 61000-6-2: 2019
  • Safety
    • UL, cUL, CB, IEC, EN 62368-1