Cincoze Compact Rugged Embedded Computer with Intel® Alder Lake-N Processor
Intel® Alder Lake-N Processor Entry Performance and Compact Rugged Embedded Computer
- Onboard Intel® Alder Lake-N Core™ i3-N305, Processor N97 and Atom® x7425E Processor
- 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 16GB Memory
- 1x M.2 Key B Type 3052/3042 Socket for 5G/GNSS Module Expansion
- 1x M.2 key B Type 2242 Socket for I/O Module Expansion
- CMI Technology for Optional I/O Module Expansions
- CFM Technology for Power Ignition Sensing Function
- Safety Standard: UL, cUL, CB, IEC, EN 62368-1
The DI-1200, with a 12th generation Intel® Core™ U-series (Alder Lake-P Platform) processor, provides outstanding performance and boasts a low power consumption of 15W. The compact DI-1200 offers rich I/O interfaces and expansion options, meeting the requirements for high-performance, rugged embedded computers used in confined spaces. It suits for industrial automation, warehousing and logistics, transportation, environmental monitoring, and IoT applications.


High Performance and Power Saving
The DI-1200 supports the 12th generation Core™ i7/i5/i3 U-series (Alder Lake-P) processor based on the Intel® 7 process. Its exceptional processing performance and ultra-low power consumption of just 15W, make it highly suitable for mobile devices limited by battery capacity.
Smaller than A5
The DI-1200 has a footprint smaller than a sheet of A5 paper, with dimensions of only 203 x 142 x 66.8 mm. It is ideal for mobile devices such as AGVs and AMRs, tight spaces in vehicles, or small cabinets in factories.




High-speed I/O
The DI-1200 offers a range of high-speed I/O, including LAN (10GbE, 2.5GbE, 1GbE), USB 3.2 (10Gbps, 5Gbps), USB 2.0, and more, making data and image transmission faster and allowing easy connection to various high-speed devices.
Comprehensive Wireless Options
The DI-1200 has one M.2 Key E slot and one M.2 Key B slot, supporting a full range of wireless transmission options, including GSM, GNSS, Wi-Fi, and Bluetooth. It also supports the Intel CNVi module, meeting diverse transmission needs.




Quick Hard Drive Removal
Mobile devices must allow quick access to data. The DI-1200 features a hot-swappable 2.5-inch SATA HDD/SSD slot in the front panel of the chassis, making it easy to remove the hard drive and access the data on it.
Secure and Rugged
The DI-1200 showcases its ruggedness and industrial-grade protections through multiple industry certifications. It complies with industrial EMC standards (IEC 61000-6-2 and IEC 61000-6-4), ensuring reliable operation in external electromagnetic interference from surrounding devices. The DI-1200 also meets the U.S. military standard, MIL-STD-810H, ensuring stable operation under extreme shock and vibration conditions.


- Processor
- Intel® Core™ i3-N305 8 Cores Up to 3.80 GHz, TDP 15W
- Intel® Processor N97 4 Cores Up to 3.60 GHz, TDP 12W
- Intel Atom® x7425E 4 Cores Up to 3.40 GHz, TDP 12W
- Memory
- 1x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and non-ECC Type, Up to 16GB
- Graphics Engine
- Integrated Intel® UHD Graphics
- Maximum Display Output
- Supports Two Independent Display (Onboard 1x DisplayPort + Optional CMI 1x Display)
- DP
- 1x DisplayPort Connector (4096 x 2304 @60Hz)
- * Verified maximum resolution: 3840 x 2160 @ 60Hz
- I/O
- LAN
- 2x 2.5GbE LAN, RJ45
- GbE1: Intel® I226
- GbE2: Intel® I226
- USB
- 2 x USB 3.2 Gen2x1 (10Gbps), Type A
- 1 x USB 3.2 Gen1x1 (5Gbps), Type A
- 1 x USB 2.0 (480Mbps), Type A
- COM
- x RS-232/422/485 with Auto Flow Control (Support 5V/12V), DB9
- Storage / Expansion
- 2.5” Storage
- 1x 2.5" SATA HDD/SSD or 1x Half-Slim SSD (SATA 3.0)
- M.2 Key B Socket
- 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x1 / USB3.2 Gen2 x1 / SATA), Support 5G/Storage/GNSS/Add-on Card Expansion
- 1x M.2 Key B Type 2242 (PCIe Gen 3x1 / USB2.0), Support GNSS/Add-on Card Expansion
- SIM Socket
- 1x Front Accessible Dual Nano SIM Socket
- 2.5” Storage
- LAN
- CMI (Combined Multiple I/O) Interface
- 1x CMI Interface for optional Display or I/O Module Expansion
- 1x CMI Interface for optional I/O Module Expansion
- CFM (Control Function Module) Interface
- 1x CFM Interface for optional IGN Module Expansion
- Other Function
- Clear CMOS Switch 1x Clear CMOS Switch
- Reset Button 1x Reset Button
- Watchdog Timer
- Software Programmable Supports 256 Levels System Reset
- Status LED Indicator
- Power LED, Storage LED, IGN LED
- Antenna Holes
- 2x Antenna Holes
- Power Button
- 1x ATX Power On/Off Button
- Power Mode Switch
- 1x AT/ATX Mode Switch
- Power Input
- 9 - 48VDC, 3-pin Terminal Block
- Remote Power On/Off
- 1x Remote Power On/Off, 2-pin Terminal Block
- Max. Power Consumption
- i3-N305 CPU: 49.4W
- N97 CPU: 35.9W
- Test conducted with CPU, 1x RAM, and 1x storage 100% load during burn-in testing
- Inrush Current (Peak)
- Remote Power LED
- 1x Remote Power LED, 2-pin Terminal Block
- Physical
- Dimension ( W x D x H )
- 185 x 131 x 56.5 mm
- Weight Information
- 1.5 Kg
- Dimension ( W x D x H )
- Mechanical Construction
- Extruded Aluminum with Heavy Duty Metal
- Mounting
- Wall / Side / DIN-RAIL / VESA Mount
- Physical Design
- Fanless Design
- Cableless Design
- Jumper-less Design
- Unibody Design
- Reliability & Protection
- Reverse Power Input
- Yes
- Over Voltage Protection
- Protection Range: 51~58V
- Protection Type: shut down operating voltage, re-power on at the present level to recover
- Over Current Protection
- 15A
- MTBF 520,224 Hours
- Database: Telcordia SR-332 Issue 3, Method 1, Case 3
- Operating System
- Microsoft® Windows®
- Windows®11, Windows®10
- Linux
- Ubuntu Desktop 22.04 LTS
- Microsoft® Windows®
- Environment
- Operating Temperature
- 12W TDP Processor: -40°C to 70°C (-40°F to 158°F)
- 15W TDP Processor: -40°C to 60°C (-40°F to 140°F)
- 15W TDP Processor: -40°C to 65°C (-40°F to 149°F) with External Fan Kit
- * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
- * With extended temperature peripherals and 1.2 m/s ambient airflow
- * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
- Storage Temperature
- -40°C to 85°C (-40°F to 185°F)
- Relative Humidity
- 12W TDP Processor: 95% RH @ 70˚C (Non-condensing)
- 15W TDP Processor: 95% RH @ 60˚C (Non-condensing)
- Shock
- MIL-STD-810H
- Vibration
- MIL-STD-810H
- Operating Temperature
- EMC
- CE, UKCA, FCC, ICES-003 Class A
- EMI
- CISPR 32 Conducted & Radiated: Class A
- EN/BS EN 55032 Conducted & Radiated: Class A
- EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
- EN/BS EN61000-3-3 Voltage fluctuations & flicker
- FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
- EMS
- EN/IEC 61000-4-2 ESD: Contact: 4 kV; Air: 8 kV
- EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 10 V/m
- EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 1 kV; Signal: 1 kV
- EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
- EN/IEC 61000-4-6 CS: 10V
- (**Compliant with the standard when utilizing shielded ethernet cable.)
- EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
- EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
- Industrial Environment
- EMC
- EN/BS/IEC 61000-6-4: 2019 Class A
- EN/BS/IEC 61000-6-2: 2019
- EMC
- Safety
- UL, cUL, CB, IEC, EN 62368-1