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  • Cincoze 12/13/14th Generation Intel CPU with MXM GPU Support
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Cincoze 12/13/14th Generation Intel CPU with MXM GPU Support

$1,645.00
SKU
GM-1100

Cincoze 14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

PRODUCTS FEATURES

  •     Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
  •     Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
  •     1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
  •     1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
  •     1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
  •     1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
  •     2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
  •     Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
  •     Wide operating temperature -40°C to 70°C
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Cincoze GPU Embedded Computers

TThe GM-1100 is a compact and rugged embedded MXM GPU computer for high-performance computing needs. It combines powerful computing and graphics processing capabilities with highly flexible expansion, making it ideal for edge AI applications with limited installation space.

3X Performance boost

Equipped with a 14th generation Intel® Core (Raptor Lake-S Refresh) processor, the GM-1100 is capable of three times the computing performance of its predecessor. For highly complex or specialized tasks the hybrid or P-core monolithic architecture can be chosen for the best performance based on specific needs.

MXM GPU module

Type A and B MXM GPU modules allow comprehensive options to suit lightweight AI or high-performance AI inference applications. The special modular design also means painless upgrades to higher-end MXM modules to bolster performance in the future.

High-speed connections and data storage

Native 2.5GbE LAN and 20Gbps USB 3.2 Gen2x2 Type-C high-speed connections effectively improve the efficiency of image and file transfer. Storage options include two 2.5” HDD/SSD bays and options for high-speed NVMe SSD storage.

Ideal for mobility applications

Compact size (260 x 200 x 85 mm), multiple M.2 expansion slots for 5G of Wi-Fi communication modules, and compliance with rail transit certification (EN50121-3-2) and vehicle certification (E-mark) make the GM-1100 ideal for mobility applications.

Superior cooling performance

The innovative thermal design improves system cooling by providing independent heat dissipation channels for the CPU and GPU to the upper cover and sides of the extruded aluminum case. Combined with an external fan, it provides a solid foundation for stable and reliable operation.

Rugged safety

The harsh challenges of the Edge AI environment are overcome with industrial grade wide temperature (-40 to 70°C) and wide voltage (9 to 48 VDC) support, and passing the US military shock standard (MIL-STD-810H) to ensure product stability and safety.

  • System Processor    
    • 14th Generation Intel® Raptor Lake-S Refresh Series CPU:
      • Intel® Core™ i9-14900 24 Cores Up to 5.8 GHz, TDP 65W
      • Intel® Core™ i7-14700 20 Cores Up to 5.4 GHz, TDP 65W
      • Intel® Core™ i3-14100 4 Cores Up to 4.7 GHz, TDP 60W
      •  
      • Intel® Core™ i9-14901TE 8 Cores Up to 5.5 GHz, TDP 45W
      • Intel® Core™ i7-14701TE 8 Cores Up to 5.2 GHz, TDP 45W
    • 13th Generation Intel® Raptor Lake-S Series CPU:
      • Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W
      • Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W
      • Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 65W
      • Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
      • Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
      • Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W
    • 12th Generation Intel® Alder Lake-S Series CPU:
      • Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W
      • Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
      • ntel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
      • Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
      • Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
      • Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
  • Chipset    Intel R680E Chipset
  • Memory    2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB
  • Graphics
    • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
    • Integrated Intel® UHD Graphics 730: Core™ i3
    • Maximum Display Output    Supports Triple Independent Display
    • DP    
      • 1x DisplayPort Connector (4096 x 2304@60Hz)
      • *Verified maximum resolution: 3840x2160@ 60Hz
    • HDMI    
      • 1x HDMI Connector (4096 x 2160@30Hz)
      • *Verified maximum resolution: 3840x2160@ 30Hz
    • VGA    
      • 1x VGA Connector (1920 x 1200 @60Hz)
  • I/O    
    • LAN
      • 1x 2.5GbE LAN, RJ45 Intel® I225
      • 1x 1GbE LAN, RJ45 Intel® I219
    • COM
      • 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
    • USB
      • 1x 20Gbps USB3.2 Gen2 x2, Type C
      • 3x 10Gbps USB3.2 Gen2 x1, Type A
      • 4x 5Gbps USB3.2 Gen1 x1, Type A
  • Storage    
    • SSD/HDD    
      • 2x 2.5" Front Accessible SATA HDD/SSD Bay Supporting Hot Swap Function (SATA 3.0) (Up to 15mm in Height)
    • M.2 SSD    
      • 1x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0)
      • 1x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3x2 NVMe SSD or SATA SSD (SATA3.0)
      • x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4x2 NVMe SSD or SATA SSD (SATA3.0)
    • RAID Support RAID 0/1/5/10
  • Expansion
    • MXM Socket 1x MXM Carrier Board Socket for MXM GPU Module Expansion
    • M.2 E Key Socket 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion
    • M.2 B Key Socket
      • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion
      • 2x M.2 Key B Type 2242 Socket (PCIe Gen 4x2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion
    • SIM Socket 2x SIM Socket
    • CMI (Combined Multiple I/O) Interface    
      • 1x High Speed CMI Interface for optional CMI Module Expansion
      • 1x Low Speed CMI Interface for optional CMI Module Expansion
    • CFM (Control Function Module) Interface    1x CFM IGN Interface for optional CFM-IGN Module Expansion
  • Other Function    External FAN Connector    2x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS)
  • Power Ignition Sensing Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module)
  • Clear CMOS Switch 1x Clear CMOS Switch
  • Reset Button 1x Reset Button
  • Instant Reboot Support 0.2sec Instant Reboot Technology
  • Watchdog Timer Software Programmable Supports 256 Levels System Reset
  • Antenna Holes 2x Antenna Holes
  • Power Input
    • -48 VDC, Single Power Source
    • Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A
    • Power input voltage from 9V to 23V must use dual power connectors, power input voltage from 24V to 48V can use single power connector
  • Remote Power On/Off 1x Remote Power On/Off, 2-pin Terminal Block
    • Max. Power Consumption
      • 35W CPU: 187.51W
      • 65W CPU: 258.96W
        - Test conducted with CPU, 1x RAM, and 1x storage
        - 100% load during burn-in testing.
    • Inrush Current (Peak)
  • Physical Dimension ( W x D x H ) 260 x 200 x 85 mm
  • Weight Information 4.73 kg
  • Mechanical Construction    Extruded Aluminum with Heavy Duty Metal
  • Mounting Wall / Side / DIN-RAIL / VESA Mount
  • Physical Design
    • Fanless Design
    • Cableless Design
    • Jumper-less Design
    • Unibody Design
  • Reliability & Protection    
    • Reverse Power Input Protection Yes
    • Over Voltage Protection    
      • Protection Range: 51~58V
      • Protection Type: shut down operating voltage, re-power on at the preset level to recover
    • Over Current Protection    30A
    • CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
    • MTBF 313,541 Hours -  Database: Telcordia SR-332 Issue3, Method 1, Case 3
  • Operating System    
    • Windows    Windows®11, Windows®10
    • Linux    Ubuntu Desktop 22.04 LTS
  • Environment    
    • Operating Temperature    
      • 35W TDP Processor: -40°C to 70°C
      • 65W TDP Processor with external FAN: -40°C to 60°C 
        * PassMark BurnInTest: 100% CPU, 2D/3D Graphics   (without thermal throttling) 
        * With extended temperature peripherals; Ambient with air flow 
        * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
    • Storage Temperature -40°C to 70°C
    • Relative Humidity 95%RH @ 70°C (non-Condensing)
  • Shock MIL-STD-810H
  • Vibration MIL-STD-810H
  • EMC
    • CE, UKCA, FCC, ICES-003 Class A
    • EN 50155 (EN 50121-3-2 Only)
    • E-mark (Pending)
  • EMI
    • CISPR 32 Conducted & Radiated: Class A
    • EN/BS EN 50121-3-2 Conducted & Radiated: Class A
    • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
    • EN/BS EN 61000-3-3 Voltage fluctuations & flicker
    • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
  • EMS
    • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
    • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
    • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
    • EN/IEC 61000-4-5 Surges: AC Power: 2 kV
    • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.)
    • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
    • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
  • Safety    
    • UL, cUL , CB, IEC, EN 62368-1