12th/13th/14th Generation Intel CPU with MXM GPU Support
14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket
PRODUCTS FEATURES
- Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
- 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
- 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
Cincoze GPU Embedded Computers
TThe GM-1100 is a compact and rugged embedded MXM GPU computer for high-performance computing needs. It combines powerful computing and graphics processing capabilities with highly flexible expansion, making it ideal for edge AI applications with limited installation space.
3X Performance boost
Equipped with a 14th generation Intel® Core (Raptor Lake-S Refresh) processor, the GM-1100 is capable of three times the computing performance of its predecessor. For highly complex or specialized tasks the hybrid or P-core monolithic architecture can be chosen for the best performance based on specific needs.
MXM GPU module
Type A and B MXM GPU modules allow comprehensive options to suit lightweight AI or high-performance AI inference applications. The special modular design also means painless upgrades to higher-end MXM modules to bolster performance in the future.
High-speed connections and data storage
Native 2.5GbE LAN and 20Gbps USB 3.2 Gen2x2 Type-C high-speed connections effectively improve the efficiency of image and file transfer. Storage options include two 2.5” HDD/SSD bays and options for high-speed NVMe SSD storage.
Ideal for mobility applications
Compact size (260 x 200 x 85 mm), multiple M.2 expansion slots for 5G of Wi-Fi communication modules, and compliance with rail transit certification (EN50121-3-2) and vehicle certification (E-mark) make the GM-1100 ideal for mobility applications.
Superior cooling performance
The innovative thermal design improves system cooling by providing independent heat dissipation channels for the CPU and GPU to the upper cover and sides of the extruded aluminum case. Combined with an external fan, it provides a solid foundation for stable and reliable operation.
Rugged safety
The harsh challenges of the Edge AI environment are overcome with industrial grade wide temperature (-40 to 70°C) and wide voltage (9 to 48 VDC) support, and passing the US military shock standard (MIL-STD-810H) to ensure product stability and safety.
- Processor
- 13th Generation Intel® Raptor Lake-S Series CPU:
- Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
- Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
- Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W
- Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W
- 13th Generation Intel® Raptor Lake-S Series CPU:
- Memory
- 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB
- Graphics Engine
- Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
- Integrated Intel® UHD Graphics 730: Core™ i3
- Maximum Display Output
- Supports Triple Independent Display
- HDMI
- 1x HDMI Connector (3840 x 2160@30Hz)
- * Verified maximum resolution: 3840x2160 @ 30Hz
- DP
- 1x DisplayPort Connector (4096 x 2304@60Hz)
- * Verified maximum DP resolution: 3840x2160 @ 60Hz
- VGA
- 1x VGA Connector (1920 x 1200 @60Hz)
- Line-out 1x Line-out, Phone Jack 3.5mm
- Mic-in 1x Mic-in, Phone Jack 3.5mm
- I/O
- LAN
- 4x 2.5GbE LAN, RJ45 (Intel I225)
- 1x 1GbE LAN, RJ45 (Intel I219)
- COM 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
- USB 6x USB 3.2 Gen1x1 (5Gbps), Type A
- LAN
- Storage SSD/HDD
- 4x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 ) (up to 15mm in Height)
- M.2 SSD
- 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4x4 NVMe SSD or SATA 3.0 SSD
- 1x M.2 SSD Shared by M.2 Key B Type 3042/3052 Socket, Support PCIe Gen 3x2 NVMe SSD or SATA 3.0 SSD
- RAID Supports RAID 0 / 1 / 5 / 10
- Expansion
- PCIe
- Optional GPU Expansion Box
- 1 x PCIe x4 + 1 x PCIe x16
- 2 x PCIe x16 (8Lanes) + 1 x PCIe x1 + 1 x PCIe x4
- SIM Socket 2 x Front Accessible SIM Socket
- M.2 E Key Socket
- 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2), Support Wireless/Intel CNVi Module Expansion
- M.2 B Key Socket
- 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2280 Socket (PCIe Gen 3x1), Support Add-on Card Expansion
- CMI (Combined Multiple I/O) Interface
- 1 x High Speed CMI Interface for optional CMI Module Expansion
- 1 x Low Speed CMI Interface for optional CMI Module Expansion
- CFM (Control Function Module) Interface
- 1x CFM IGN Interface for optional CFM-IGN Module Expansion
- 1x CFM PoE Interface for optional CFM-PoE Module Expansion
- PCIe
- Other Function FAN 2x Fan Kits ( Air-flow isolated from the electronics )
- Power Ignition Sensing Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module)
- Clear CMOS Switch 1x Clear CMOS Switch
- Reset Button 1x Reset Button
- Instant Reboot Support 0.2sec Instant Reboot Technology
- Watchdog Timer Software Programmable Supports 256 Levels System Reset
- Antenna Holes 7x Antenna Holes
- Power
- Power Button 1x ATX Power On/Off Button
- Power Input Voltage 9 - 48VDC, Single Power Input
- Connector 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A
- Dual power connect must be used at the same time due to 15A current limitation at each power connector.
- Power Mode Switch 1x AT/ATX Mode Switch
- Remote Power On/Off 1x Remote Power On/Off, 2-pin Terminal Block
- Remote Power LED 1x Remote Power LED, 2-pin Terminal Block
- Max. Power Consumption
- 35W CPU
- OS Idle Mode: 108.89W
- Full Loading: 201.05W
- 65W CPU
- OS Idle Mode: 107.76W
- Full Loading: 306.48W
- 35W CPU
- Inrush Current (Peak)
- Physical
- Dimension ( W x D x H ) 105 x 195 x 370 mm
- Weight Information 7.7 Kg
- Mechanical Construction Extruded Aluminum with Heavy Duty Metal
- Mounting Tower Stand / Desktop / 19" Rack / Vehicle Mount
- Physical Design
- Jumper-less Design
- Unibody Design
- Reliability & Protection
- Reverse Power Input Protection Yes
- Over Voltage Protection
- Protection Range: 51~58V
- Protection Type: shut down operating voltage, re-power on at the preset level to recover
- Over Current Protection 30A
- CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
- MTBF 432,065 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3
- Operating System
- Windows®11, Windows®10
- Environment
- Operating Temperature
- 35W TDP Processor: -40°C to 70°C
- 65W TDP Processor with external FAN: -40°C to 60°C
- Storage Temperature -40°C to 70°C
- Relative Humidity 95%RH @ 70°C (non-Condensing)
- Shock MIL-STD-810H
- Vibration MIL-STD-810H
- Operating Temperature
- EMC
- CE, UKCA, FCC, ICES-003 Class A
- EN 50155 (EN 50121-3-2 Only)
- E-mark (Pending)
- EMI
- CISPR 32 Conducted & Radiated: Class A
- EN/BS EN 50121-3-2 Conducted & Radiated: Class A
- EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
- EN/BS EN61000-3-3 Voltage fluctuations & flicker
- FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
- EMS
- EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
- EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
- EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
- EN/IEC 61000-4-5 Surges: AC Power: 2 kV
- EN/IEC 61000-4-6 CS: 10V
- EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
- EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
- Fire Protection EN 45545-2